Flip Chip Package Designer

Aerotek is looking for a Flip Chip Package Designer for our client, one of the leading global Electronics Manufacturers in the world, on a 6 month contract. This has contract has the possibility to be extended. Job Duties: Our client is looking for a Flip chip/BGA package designer with 5 years of experience. They must be experienced in either Cadence APD or Cadence SiP. You will be responsible for package layout, optimization, design verification and taping out. Flip chip is being designed for …

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